The Role of Foundry for High-Performance AI Semiconductors
Abstract
Recently, the AI semiconductor market has been experiencing rapid advancements across multiple dimensions, including computational performance, energy efficiency, and integration density. As a result, not only the design capabilities of fabless companies but also the manufacturing capabilities of foundry companies that implement these designs have become more critical than ever. In particular, achieving high yield, possessing advanced process technologies, and securing advanced packaging capabilities have emerged as key factors for realizing high-performance AI semiconductors.
This study selects TSMC, the world’s largest foundry company, as a case and analyzes how the company secures manufacturing competitiveness in AI semiconductors through yield management, process control, and advanced packaging technologies. The findings indicate that TSMC enhances AI semiconductor performance through integrated management across the entire value chain—from design and manufacturing to packaging and mass production—while maintaining stable production capabilities and making proactive R&D investments in advanced packaging. These results demonstrate that the integrated management of yield, process, and packaging constitutes a core mechanism for improving AI semiconductor performance.
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Keywords
Details
| Section | Articles |
| Issue | Vol. 2 No. 2 (2026): Volume 2 Issue 2 (Jun 2026) |
| Published | 2026-06-18 |
| Pages | 26-37 |
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